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Mar 3, 2016
Product Name: Thermoplastic Polyimide Moulding Powder
Mesh size: ≥800 Mesh
SPECIFICATIONS:
Properties | Testing Method | Unit | Value | |
Basic performance | Appearance | / | / | Light Yellow |
Linear expansion coefficient of (23-30℃) | GB/T 1036-1989 | 1/℃ | 3.68*10-5 | |
Density(25℃) | / | g/cm3 | 1.38 | |
Intrinsic viscosity | Q/HSMT | dL/g | 0.5-0.8 | |
Rockwell hardness (m) | GB/T 3398.2-2008 | / | 110 | |
Oxygen index | GB/T 2406.2-2009 | % | 46 | |
The vertical combustion | GB/T 2408-2008 | level | V-0 | |
Mechanical properties of | The tensile strength | GB/T 1040.2/1A-2006 | MPa | 108 |
Elongation at break | GB/T 1040.2-2006 | % | 15 | |
The impact strength (no gap) | GB/ 1043.1/1eU-2008 | KJ/m2 | 244 | |
The bending strength | GB/T 9341-2008 | MPa | 135 | |
The compression strength | GB/ T 1041-2008 | MPa | 136 | |
The coefficient of friction | GB/T 3960-1983(1989) | / | 0.43 | |
Thermal performance | The thermal deformation temperature(1.80MPa) | GB/T 1634.2-2004 | ℃ | 250 |
Glass transition temperature (nitrogen atmosphere) | GB/T 19466.2-2009 | ℃ | 260 | |
Electrical properties | Dielectric strength | GB/T 1408.1-2006 | MV/m | 16.3 |
Volume resistivity | GB/T1410-2006 | Ω·m | 2.0*1014 | |
Definition: A highmolecular weight, poor mobility, used for molding. Thermoplastic PI is an amorphousresin, the products made from thermoplastic PI is amber and transparent.
Main Characteristics:
In a word, SOLVER Thermoplastic Polyimide Moulding Powder (SolverPI-Powder1600) cancompletely replace Mitsui AURUM.
Advantageswhen compared with other special engineering plastics:
1. Comparedwith PEEK\PPS, thermoplastic PI is a non crystalline, showing better stabilityof mechanical properties and size at high temperature condition. While thecrystalline plastic will continue to crystallization or crystallization damage whenusing the temperature between Tg and Tm, causing the mechanical changes anddecreasing dimensional stability, creep resistance reducing.
2.Compared with PTFE, better dimensional stability, better creep resistance and highstrength, the shortage is worse corrosion resistance.
3.Stabler performance in the high or low temperature performance. The processingtemperature can be 340-380 ℃, lowerthan Aurum. It no need heat treatment after the molding process.
4. Thermalproperties: Tg:260 ℃, HDT:250 ℃, long-term use temperature is 240 ℃. At the same time, also has very good performance of lowtemperature resistant, will not brittle fracture at the temperature of -269 ℃ in liquid nitrogen.
Comparedwith BMI
Theperformance of BMI is more brittle, it will break off during the use ofprocess.
SolverPI-Powder 1600X is showing as melting state during thermoplasticmolding, the adhesion and toughness is better then not easier to be cracked.
Usagelife is longer. BMI can be used for 4 hours, while SolverPI-Powder 1600X can be used continuously for72 hours.
Using temperaturecan be higher. SolverPI-Powder 1600X can keep stable within 240 ℃
In thehigh-end abrasive in German are using polyimide as binder.
Application:
Pressall kinds of machinery, electronic components, such as floating seal ring,sealing ring, bush pressed sheet, rod, diamond grinding tools etc.
Thedemand of high grade diamond abrasive for thermoplastic PI is big because thetraditional adhesives can not meet their requirements.